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Inspection & Test

REDCOM routinely designs and implements testing strategies from component- level to full system functional tests. Thermal cycling and burn-in are standard processes. By consideration of PCBA and system performance/functionality targets against assembly, test and inspection equipment capabilities, maximum value is obtained from dollars spent on test. REDCOM engineers will discuss this aspect of your project prior to any formal establishment of requirements

Here’s a partial list of REDCOM Test and Inspection equipment:

• Despatch 16000 Series Thermal Cycling Ovens (-29° C to 177° C)
• ACS Environmental Chamber (-75° C to 180° C)
• Glenbrook X-RAY (Jewel Box)
• Acculogic “Flying Probe” manufacturing defect analyzer
• NI LabVIEW (top layer) + programmable devices
• Teradyne In-Circuit Test (bed of nails)
• EMI Screening facility